Features: ---The heart of this station is SAMSUNG microcomputer processor and PID technology to trace temperatures on air gun and iron in real time and compensate temp precisely and quickly by built-in PID control program. So keeping temperature stability within 2oC and quick temperature rising to set value. ESD design of soldering iron to protect sensitive components. ---Designed for SOIC, CHIP, QFP, PLCC, BGA and temperature-sensitive components. Very good for electronics product, such as cell phone, repair. ---Dual large 3-digit LCD displays to track actual temperatures. Easy to adjust temp. ---Diaphragm fan in hot air gun provides steady airflow up to 24 Liter/min. Easy adjust the hot airflow with air flow knob. ---Designed for SOIC, CHIP, QFP, PLCC, BGA and temperature-sensitive components. Very good for cell phone, computer repair. ---With short circuit, open circuit, over-temp and over-load protection. ---Diaphragm pump has some noise, less than 55dB. ---Fits for heating shrink, drying, lacquer removal, viscosity removal, ice-out, pre-heating and glue soldering. ---CE approved. Hot Air Gun Specifications: Power Consumption: 650W. Air Flow Type: Gentle Wind with diaphragm pump. Air Flow Volume: 24 L/MIN. Temperature Range: 100 - 480 deg C. Temperature Stability: ± 1 deg C. Noise Level: 55 dB. Soldering Iron Specifications: Power Consumption: 70W (50W, 24V on heating element). Iron: ESM design. Temperature Range: 100 - 480 deg C. Temperature Stability: ± 2deg C.
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